Parts reportedly geared toward high-performance compute and leverage advanced packaging
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AD Technology specializes in the design and implementation of silicon interposers – a form of advanced packaging. They're often used to connect compute dies, like GPUs, with high-bandwidth memory over the shortest distance possible. This suggests that the silicon may be used in an AI accelerator or some other bandwidth-constrained application.
"This three-nano project will be one of the largest semiconductor projects in the industry," Joon-gyu Park, CEO of AD Technology, opined."I think this three-nano and 2.5D design experience will be a big weapon that will differentiate AD Technology from other companies in the future." For Samsung, the contract win is significant as much of the datacenter silicon that makes use of advanced packaging is fabbed by TSMC. That's not to say Samsung hasn't had successes in the arena – Baidu and SamsungNvidia has also worked with Samsung to produce several of its A-series GPUs, like A16, on an 8nm process node. However, anything that relied on HBM, like Nvidia's A100, was built by TSMC.
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