Intel’s future chips will sit on a substrate made of glass instead of resin — allowing 10x the connections, less warping, larger chips, better power transfer, higher temps, and less mechanical breakage because silicon and glass expand at the same rate, reports CNET’s Stephen Shankland. One analyst told him the whole industry will go glass — a way to keep Moore’s Law going, perhaps.
Intel’s future chips will sit on a substrate made of glass instead of resin — allowing 10x the connections, less warping, larger chips, better power transfer, higher temps, and
less mechanical breakage because silicon and glass expand at the same rate, reportsOne analyst told him the whole industry will go glass — a way to keep Moore’s Law going, perhaps.
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