The latest U.S. government action against China's Huawei takes direct aim the company's HiSilicon chip division--a business that in a few short years has become central to China's ambitions in semiconductor technology but will now lose access to tools that are central to its success.
The new U.S. rule requires licenses for companies using U.S. machinery to build Huawei-designed chips and delivered to the Chinese firm. To be sure, the new rule will not catch items shipped to a third party, allowing HiSilicon’s fabricators like TSMC the ability to ship chips to HiSilicon’s device manufacturers who can send them directly to a customer.
“You almost have to think about it like a heart transplant,” said VLSI Research Chief Executive Dan Hutcheson, noting that chip production lines are finely calibrated systems where everything has to work well together. Doug Fuller of the Chinese University of Hong Kong said Huawei had a few options. It could slip around the rule by having suppliers ship directly to Huawei customers, though the U.S. officials said they would be vigilant about such workarounds.
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