This article explores the remarkable progress made by TSMC in shrinking transistor sizes and increasing chip performance. From the original iPhone's 90nm chip to the upcoming 1.6nm nodes, the article highlights the future potential of smartphone technology.
Reserving a Galaxy S25 gives you a $50 Samsung Credit, extra savings of up to $1,250, and a chance to win $5,000! The speed at which top foundries are advancing in their relentless pursuit to enhance the speed, performance, and efficiency of smartphone chips is truly remarkable. Just this year, TSMC , the world's leading foundry, is poised to commence mass production of 2nm chip s. Next year, the Taiwan-based company predicts it will initiate mass production of 1.6nm chip s.
As these process node numbers decrease, the size of the transistors within these chips diminishes, allowing for a greater number to be integrated. This is crucial because smaller transistors signify that more can be accommodated within a given area of the chip. This metric, known as transistor density, generally escalates when the process node decreases. The transistor count of a chip is also significant because, typically, the larger the number of transistors in a chip, the more powerful and energy-efficient these semiconductors become. Consider the astonishing decline in process nodes witnessed over the past few years. For instance, in 2019, the iPhone 11 series was powered by the 7nm A13 Bionic application processor (AP) containing 8.5 billion transistors. This past September, the iPhone 16 series was unveiled with the 3nm A18 Pro AP. While Apple refrained from disclosing the transistor count for the chipset, the component likely boasts over 20 billion transistors, considering that the A17 Pro has 19 billion. TSMC is experiencing remarkable growth as it just reported fourth-quarter revenue soaring 37% year-over-year to $26.88 billion. What TSMC refers to as 'smartphone seasonality' will lead to a sequential decline in its top line for Q1 2025, although on an annual basis, first-quarter gross will increase by 34.7%. With its 2nm chip production, TSMC will commence utilizing Gate-All-Around (GAA) transistors, which employ vertically stacked horizontal nanosheets, enabling the gate to encompass all four sides of the channel, preventing current leaks and improving the drive current. The outcome is higher-performing chips with enhanced energy efficiency. When it initiates production of 1.6nm chips, TSMC will debut backside power delivery (BPD). BPD relocates power delivery from the front of a silicon wafer, where it leaves less space for transistors, to the back, where it is unimpeded by other wires. The A18 Pro application processor, manufactured using TSMC's second-generation 3nm node, powers the iPhone 16 Pro and Pro Max models. To illustrate how far we've progressed, the original iPhone, released in 2007, utilized a chip built on the 90nm process node. The upcoming iPhone series scheduled for launch this September will be powered by the 3nm A19 and A19 Pro APs, which will be fabricated using TSMC's third-generation 3nm node (N3P). Consequently, Apple should be able to introduce the first iPhone to run on 2nm silicon with the 2026 iPhone 18 series. Regarding the timeline for the first iPhone featuring an AP made using the 1.6nm node, we will have to await further information. Meanwhile, TSMC states that 1.6nm chips will offer an 8% to 10% improvement in speed at the same power compared to the 2nm node. Follow us on social media to stay abreast of the latest trending stories, watch exclusive videos, and engage in discussions with our vibrant community
TSMC Smartphone Technology Chip Manufacturing Transistor Density Process Nodes A18 Pro Iphone 16 2Nm Chip 1.6Nm Chip
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