Researchers at the University of Hong Kong have developed a groundbreaking method for creating ultra-thin diamond wafers using sticky tape. This innovation could lead to the development of diamond-based electronics, offering a potentially superior alternative to silicon.
Researchers have discovered a novel method for producing ultra-thin diamond wafers using sticky tape . This breakthrough could pave the way for the development of diamond-based electronics, potentially offering a superior alternative to silicon-based designs. Diamond, known for its excellent insulating properties and ability to allow electrons with specific energies to flow with minimal resistance, holds the promise of handling higher energies more efficiently than conventional silicon chips.
However, fabricating functional diamond chips necessitates large, exceptionally thin wafers, which have proven challenging to create. A team led by Professor Chu at the University of Hong Kong has devised a technique to produce extremely thin and flexible diamond wafers using sticky tape. The process involves implanting nano-sized diamonds into a silicon wafer, followed by exposing it to methane gas at high temperatures to form a continuous, thin diamond sheet. A small crack is then introduced, allowing the diamond layer to be peeled off using ordinary sticky tape. Notably, the resulting peeled diamond sheet is remarkably thin, less than a micrometer, and possesses the smoothness required for etching techniques commonly employed in silicon chip manufacturing. Professor Chu's findings draw parallels to the early days of graphene research, where Scotch tape was instrumental in isolating the first monolayer of graphene from graphite. While the current diamond membranes produced are approximately 5 centimeters in size, demonstrating the feasibility of the method, scaling up the process to match the standard wafer size of 20-30 centimeters remains uncertain
Diamond Electronics Nanotechnology Materials Science Sticky Tape
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