Scientists at University of Chicago achieve breakthrough by bonding diamond to other materials for use in advanced electronics.
Diamond has unique properties that make it excellent for both electronics and quantum technologies .They have developed a new technique that allows them to directly bond diamonds to a variety of materials. This includes common substrates like silicon and sapphire.
“Diamond stands alone in terms of its material properties, both for electronics—with its wide band gap, very best thermal conductivity, and exceptional dielectric strength—and for quantum technologies—it hosts nitrogen vacancy centers that are the gold standard for quantum sensing at room temperature,” explained Asst. Prof. Alex High from UChicago Pritzker School of Molecular Engineering .For quantum technologies, diamond hosts nitrogen vacancy centers.
Second, they carefully bring the two surfaces together, ensuring they are perfectly flat. An annealing process then strengthens the bond, making it robust enough to withstand the rigors of nanofabrication processes.This breakthrough allows for the integration of ultra-thin diamond membranes, as thin as 100 nanometers, with other materials.
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