South Korea's Samsung Electronics Co Ltd is considering setting up a chip packaging test line in Japan, five people said, to bolster its advanced packaging business and forge closer ties with Japanese makers of semiconductor equipment and materials.
is considering setting up a chip packaging test line in Japan, five people said, to bolster its advanced packaging business and forge closer ties with Japanese makers of semiconductor equipment and materials.
Samsung is looking to establish the facility in Kanagawa prefecture, near Tokyo, where it already has a research and development centre, according to four of the people, all of whom declined to be identified because the information is not public. However, one of the people said deliberations were still in an early stage, adding the South Korean company was considering various options and nothing has been decided.Companies are racing to develop advanced packaging techniques, which involve placing chips with different functions into a single package, to enhance overall capabilities and limit the added cost of more advanced chips.
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