Qualcomm and MediaTek's upcoming flagship application processors (APs) will be manufactured using TSMC's 3rd-generation 3nm process node (N3P). This is expected to keep AP prices in check, benefiting smartphone manufacturers and potentially limiting price hikes for consumers. However, prices for LPDDR5X RAM memory have already increased and further hikes are anticipated, potentially impacting 2025 flagship models.
Qualcomm and MediaTek's newest application processors are expected to be rolling out of TSMC 's fabs later this year. The world's top foundry will be using its 3rd-generation 3nm process node to produce the flagship application processors designed by the aforementioned companies. Staying with the 3nm process to build chips like the Snapdragon 8 Elite Gen 2 and the Dimensity 9500 should keep price hikes for these components in check.
A message posted on Chinese social media site Weibo by proficient leaker Digital Chat Station notes that while TSMC will charge clients like Qualcomm and MediaTek more to make their APs using its third-gen 3nm process node,. Smartphone buyers will benefit the most since manufacturers won't have to raise their prices too much to keep their profit margins steady.
Alan, an ardent smartphone enthusiast and a veteran writer at PhoneArena since 2009, has witnessed and chronicled the transformative years of mobile technology. Owning iconic phones from the original iPhone to the iPhone 15 Pro Max, he has seen smartphones evolve into a global phenomenon. Beyond smartphones, Alan has covered the emergence of tablets, smartwatches, and smart speakers.A discussion is a place, where people can voice their opinion, no matter if it is positive, neutral or negative.
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