A new liquid metal technique could make creating nanoscale components like microchips and processors even easier.
A groundbreaking new method promises to reshape the way we manufacture nanoscale electronic components. It could offer a faster, cheaper, and more reliable alternative to traditional chip-making techniques. Developed by a team at North Carolina State University, this innovative approach uses liquid metal that can self-assemble into precise, functional structures. The process starts with a special alloy called Field's metal, made of indium, bismuth, and tin.
In contrast, this technique produces highly uniform structures with minimal waste by simply shaping the material within a mold. Once the structures are formed, they’re heated to 600 degrees Celsius, causing the material to fuse into robust semiconductor wires. Then, a graphene coating naturally forms to enhance electrical conductivity and prevent degradation.
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