Intel is proposing a new kind of architecture for laptops and mini PCs that would extend the lifespan of devices and decrease e-waste.
Intel has released a paper detailing potential plans to manufacture modular laptops and mini PCs. This approach would decrease e-waste and minimize carbon footprint, as well as make devices repairable and upgradable for users.
Recommended Videos This means you can’t remove them or reach what’s beneath them. This is called an all-in-one motherboard design, and Intel’s paper proposes splitting it into three separate parts: the motherboard and two IO modules. The IO modules would be designed to work with fanless, single-fan, and dual-fan systems for both consumer and commercial markets. By using common parts across multiple models, Intel could significantly improve the efficiency of the manufacturing process.
As for mini PCs, their current all-in-one design would also be broken down into three — a GPU module, a CPU module, and a Platform Controller Hub module. This would work pretty much like a miniature desktop PC, letting you replace the modules and other parts as you want.
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