Exclusive-Samsung's 8-layer HBM3E chips clear Nvidia's tests for use, sources say

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Exclusive-Samsung's 8-layer HBM3E chips clear Nvidia's tests for use, sources say
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Exclusive-Samsung's 8-layer HBM3E chips clear Nvidia's tests for use, sources say

The qualification clears a major hurdle for the world's biggest memory chipmaker which has been struggling to catch up with local rival SK Hynix in the race to supply the advanced memory chips capable of handling generative AI work.

Samsung has been seeking to pass Nvidia's tests for HBM3E and preceding fourth-generation HBM3 models since last year but has struggled due to heat and power consumption issues, Reuters reported in May, citing sources. "Samsung is still playing catch up in HBM," said Dylan Patel, founder of semiconductor research group SemiAnalysis.

The latest test approval follows Nvidia's recent certification of Samsung's HBM3 chips for use in less sophisticated processors developed for the Chinese market, which Reuters reported last month. Samsung forecast in July that HBM3E chips would make up 60% of its HBM chip sales by the fourth-quarter, a target that many analysts say could be achieved if its latest HBM chips passed Nvidia's final approval by the third quarter.

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