With smartphones entering the AI age and having to drive processor intensive applications, there is a need for active chip cooling like the xMEMS XMC-2400 µCooling chip.
The xMEMS XMC-2400 µCooling chip is built into the silicon of microchips and can reduce theA market leader in solid-state, microspeaker technology has announced a new form of air cooling for ultraportable electronic devices like smartphones. With powerful processors being used for intensive tasks like AI, there is a need to ensure microchips can be actively cooled.
For the first time, with active, fan-based micro-cooling at the chip level, manufacturers can integrate this active cooling into their smartphones, tablets and other advanced mobile devices. The silent, vibration-free and solid-state xMEMS XMC-2400 µCooling chip measures just one millimeter thick.... “Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS the CEO and Co-Founder of the company.
The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams, making it 96% smaller and lighter than non-silicon-based alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure.The all-silicon solution has the kind of reliability that semiconductors are renowned for as well as part-to-part uniformity, robustness and an IP58 rating.
xMEMS will begin demonstrating XMC-2400 to its lead customers and partners in September at xMEMS Live events in Shenzhen and Taipei.
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