Broadcom has unveiled its 3.5D XDSiP platform, revolutionizing AI accelerator technology with advanced silicon integration for XPUs.
Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.
Broadcom’s 3.5D integration combines the benefits of 2.5D packaging and 3D technology, setting the stage for the future of XPU development. Compared to the traditional Face-to-Back approach, the F2F method achieves a remarkable sevenfold increase in signal density. It reduces power consumption by ten times at the die-to-die interfaces.The integration allows smaller interposer and package sizes, leading to cost savings and improved package stability.
Dr. Kevin Zhang, Senior Vice President of Business Development & Global Sales at Taiwan Semiconductor Manufacturing Company , added,
AI F2F Inventions And Machines
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