A recent Chiphell forum leak reveals AMD's plans to utilize TSMC's N3E process node for its next-generation Radeon GPUs and potentially for future CPUs. The leak highlights the development of UDNA GPUs, aiming to unify AMD's GPU architectures and deliver flagship models competing with Nvidia's RTX cards. AMD is also planning to leverage advanced lithography nodes for its Zen 6 CPUs and exploring 3D V-Cache integration on both CPU and GPU components.
A recent leak on the Chiphell forums has uncovered AMD 's ambitious roadmap for its upcoming CPU and GPU architectures. Forum member zhangzhonghao's post indicates that AMD is gearing up to utilize TSMC 's cutting-edge N3E process node for its next-generation Radeon GPUs and potentially for some of its future CPUs. This leak sheds light on the development of GPUs based on the novel UDNA architecture, set to succeed the current RDNA.
These GPUs are anticipated to include a flagship model capable of rivaling Nvidia's top-tier GeForce RTX cards, addressing the current void of a high-end option in AMD's RDNA 4 lineup. AMD confirmed its work on UDNA at IFA last year, hinting at its potential applications across both gaming and enterprise sectors. Recognizing the inefficiencies arising from its previous separate GPU architectures, RDNA for gaming and CDNA for compute, AMD has opted for a unified UDNA approach. This strategic shift aims to simplify development processes and enable streamlined software optimization across its entire GPU portfolio. The selection of TSMC's N3E node, an enhanced version of the 3nm process, underscores AMD's commitment to performance and efficiency gains. This technology promises higher transistor density and superior power management, potentially translating into enhanced gaming and compute capabilities. The UDNA architecture could also incorporate upgrades for ray tracing and AI workloads, areas where AMD has historically lagged behind its competitors.On the CPU front, the leak suggests that AMD is planning to leverage TSMC's N3E process node for its upcoming Zen 6 CPU CCDs, while the N4C node is expected to be employed for the next-generation IO dies. This transition to advanced lithography nodes, coupled with architectural changes, indicates that AMD's next-generation CPUs could experience a more significant performance uplift compared to previous generational advancements. The post further reveals that AMD is developing more X3D chips, including the next-generation Halo, a successor to Strix Halo. The company is actively exploring the integration of 3D V-Cache on both CPU and GPU components, potentially enabling X3D tiles on both the CCD and IOD in its chiplet designs. It is also speculated that the next-generation Sony PlayStation 6 APU will incorporate 3D V-Cache, while Microsoft's stance on implementing this technology in its future Xbox console remains undecided.
AMD Cpus Gpus TSMC N3E UDNA Ray Tracing AI X3D 3D V-Cache
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